June 22-24,2018
Singapore
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About ISAMSE 2018
 
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>> News:由于之前邮箱故障,现联系邮箱改为: isamse@163.com


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Welcome to 2018 3rd International Seminar on Advances in Materials Science and Engineering (ISAMSE 2018). ISAMSE 2018 will be held on June 22-24, 2018, Singapore.
 
The aim of ISAMSE 2018 is to provide a platform for researchers, engineers, academicians, as well as industrial professionals, to present their research results and development activities in materials science and engineering. It provides opportunities for the delegates to exchange new ideas and application experiences, to establish business or research relations and to find global partners for future collaboration.
 
All submissions to the ISAMSE 2018 will be sent to at least two reviewers and evaluated based on originality, technical and research content, relevance to conference, contributions, and readability. The full paper submissions will be chosen based on technical merit, interest, applicability, and how well they fit a coherent and balanced technical program.

本会议是AEIC学术交流资讯中心系列会议,均已在科学网和中国知网发布。更多AEIC学术交流资讯中心系列会议,请打开AEIC官网。如需AEIC期刊服务和编译服务,请点击(click)。

 
Publication
1. All accepted full papers will be published in IOP Conference Series: Materials Science and Engineering (MSE)(ISSN: 1757-8981) and will be submitted to Ei Compendex, Scopus for indexing.
ISAMSE 2018会议的论文将被EI目录系列期刊 IOP Conference Series: Materials Science and Engineering (MSE)(ISSN: 1757-8981)出版,出版后提交EI检索


*ISAMSE2017:检索链接(click
 
2. All the papers will be peer reviewed. Selected presented papers with good quality will be recommended to publish in the special issues of following SCI/EI indexed journals without charge:
经过同行评审后,优秀的论文将免费推荐到以下期刊专刊出版(被推荐的论文必须要有一名代表参会):

(1)Materials (ISSN 1996-1944, IF:2.654)
(2)Metals (ISSN 2075-4701, IF:1.984)


本会议是AEIC学术交流资讯中心系列会议,均已在科学网和中国知网发布。更多AEIC学术交流资讯中心系列会议,请打开AEIC官网。如需AEIC期刊服务和编译服务,请点击(click)。
For more details, please click Learn more
Countdown: 0 Days
Important Dates
Submission: June 15, 2018
Notification: About 2 weeks after the submission
Registration: June 2, 2018
Conference: June 22-24,2018
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